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DSDP/Packaging/Proposal

< DSDP‎ | Packaging
Revision as of 11:23, 9 March 2009 by Unnamed Poltroon (Talk)

DSDP Packaging (D-Pack) is a proposed open-source sub-project under the Device Software Development Platform master-project. The goal of this project is to enable multiple distributions of Eclipse that respectively provide turnkey environments for very specific developer communities found in the broader embedded systems marketplace.

This proposal is in the Pre-Proposal Phase as defined in the Eclipse Development Process document and follows the Eclipse Proposal Guidelines. It is written to declare the intent and scope of the project, as well as to solicit additional participation and input from the Eclipse and embedded developer community. You are invited to comment upon and/or join this project. Please send all feedback to the http://www.eclipse.org/newsportal/thread.php?group=eclipse.dsdp.dpack newsgroup.

Background

While usage of Eclipse continues to grow amongst embedded software developers, creation of turnkey downloads satisfying the needs of this community -- not unlike what's current provided through the EPP project -- remains elusive for a number of reasons.


Scope

Organization

References

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