DSDP Packaging (D-Pack) is a proposed open-source sub-project under the Device Software Development Platform master-project. The goal of this project is to enable multiple distributions of Eclipse that respectively provide turnkey environments for very specific developer communities found in the broader embedded systems marketplace.
This proposal is in the Pre-Proposal Phase as defined in the Eclipse Development Process document and follows the Eclipse Proposal Guidelines. It is written to declare the intent and scope of the project, as well as to solicit additional participation and input from the Eclipse and embedded developer community. You are invited to comment upon and/or join this project. Please send all feedback to the http://www.eclipse.org/newsportal/thread.php?group=eclipse.dsdp.dpack newsgroup.
While usage of Eclipse continues to grow amongst embedded software developers, creation of turnkey (entry-level) downloads satisfying the needs of this community—not unlike what's currently provided through the EPP project–remains elusive for a number of reasons. For starters, the community of embedded software developers will always remain a very fragmented one due to the sheer diversity of the underlying hardware platforms targeted by this community–ranging from powerful multi-core SOCs capable of supporting Linux and Java, right down to resource-constrained 8/16-bit MCUs with little/no runtime support. Given this diversity, attempts to create a single distribution of Eclipse targeting embedded software developers would clearly become futile.
Making matters worse, any usage of Eclipse for embedded software development invariably requires integration of legacy host tooling (such as a compiler) along with legacy target content (such as an RTOS) specific to the hardware platform at hand. Not only do these elements maintain an existence outside of the Eclipse IDE per se, these tools and content often carry non-EPL licenses that would preclude provisioning from any eclipse.org server.
Responding to this reality,